| 摘要 |
PURPOSE:To enable any positional or rotary deflection in the coordinate system of a chip to be observed from an observation window when a collet head is lowered above the package base etc. by a method wherein the observation window able to observe inside an absorbing hole is provided on a collect head to adsorb a semiconductor chip. CONSTITUTION:An almost cylindrical collet 3 is free-rotatably held by the ends of an arm 2 through the intermediary of bearings 4. Then a truncated quadrapyramid-like chip adsorbing hole 5 corresponding to the rectangular configuration of a rectangular sheet type semiconductor chip is recessed downward. Furthermore, a square peep cylinder 7 aligned with its axial line is continuously connected to an opening upper end of a peep hole 6; a half mirror 8 is fixed to the middle part of this cylinder 7 at an oblique angle of 45 deg. in the airtight state; simultaneously an opening is made as an observation window 9 on the upper end of the peep cylinder 7 so that the space in the adsorbing hole 5 on the lower end may be observed from the observation window 9.
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