| 摘要 |
PURPOSE:To improve the reliability of a superconducting circuit device via reduction of the electrode disconnection or the like by making the ground surface on which a superconducting electrode is placed into a planar structure consisting of the principal surfaces of a resis tor element and an inter-layer insulating film, thereby freeing the thickness of the superconducting electrode from the restriction by the thickness of the resistor element. CONSTITUTION:On an insulating substrate 1, a grand plane 2 using a superconductor, e.g., Nb is placed, and through a first inter-layer insulating film 3 using, e.g., SiO, a first-layer superconducting writing 4 composed of, e.g., Nb or a first planarized buried layer 5 composed of, e.g., SiO is placed. To be stacked on this, a second inter- layer insulating layer 6 composed of, e.g., SiO and containing a superconducting contact 7 using, e.g., Nb is placed. A resistor element 8 composed of, e.g., Mo is buried in the second inter-layer insulating film 6, and the principal surfaces of the resistor element 8 and the second inter-layer insulating film 6 are connected with good flatness. On the principal surface of the resistor element 8 with good flatness and the second inter-layer insulating film 6, a superconducting electrode 9 composed of, e.g., Nb is placed. If encessary, a second flatly buried layer 10 composed of, e.g., SiO may be placed in the region in which the superconducting electrode is not formed.
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