发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a sealing glass from cracking by providing integrally a projection planely disposed corresponding to the peripheral edge of a sealing cap on a substrate formed with metallized layer of an insulating substrate, and mounting the cap in hermetically sealing manner with sealing glass at the projection. CONSTITUTION:A projection 9 formed in a square frame shape along the periphery of a transparent window 3a of plane shape is integrally formed corresponding to the peripheral edge of a cap 6 on an insulating substrate 3. The projection 9 is formed by baking with the same ceramic as the substrate 3 in thickness slightly larger than that of a metalized layer 4 or external leads 8. The cap 6 is bonded at the peripheral edge by sealing glass 7 made of low melting point glass on the projection 9. Thus, the sealing glass does not generate cracking even by thermal stress due to the thermal expansion difference between a heat sink plate and the substrate.
申请公布号 JPS62104054(A) 申请公布日期 1987.05.14
申请号 JP19850242757 申请日期 1985.10.31
申请人 NEC CORP 发明人 IINO HIRONARI
分类号 H01L23/02;H01L23/10;H01L23/36 主分类号 H01L23/02
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