发明名称 INSULATING WIRE BONDING METHOD
摘要 PURPOSE:To perform bonding under the best state, by heating a bonding tool with a heating means, thereby fusing or evaporating an insulating material completely. CONSTITUTION:An insulating material 2g of an insulating wire 2 is fused or evaporated to the insulating wire 2, which is protruded from a tip 5a of a bonding tool 5, with an electric torch, and a ball state 2B is formed. Then, an upper clamper 3 is closed and a lower clamper 4 is opened. Under this state, the bonding tool 5 is lowered, and the formed ball state 2B is attached to the tip 5a of the bonding tool 5. Ball bonding is performed to a pellet 9 together with ultrasonic wave thermal compression. Since the bonding tool 5 is always heated with a tool heater 6, the higher effect of diffusion or evaporation can be expected in forming the ball state 2B by the diffusion or the evaporation of the insulating material 2g of the insulating wire 2.
申请公布号 JPS62104127(A) 申请公布日期 1987.05.14
申请号 JP19850244310 申请日期 1985.10.31
申请人 TOSHIBA CORP 发明人 YAMAGUCHI MASAYOSHI;YONEZAWA MICHINARU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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