| 摘要 |
PURPOSE:To implement simple manufacturing, low costs and improvement in manufacturing yield rate, by constituting a bump electrode with an organic macromolecular polymer, to which high conductivity is imparted, thereby preventing chemical reaction with a basis metal electrode, and omitting a barrier metal layer between both parts. CONSTITUTION:A required part in a protecting film 4 is selectively etched and a hole is provided. A part of a metal electrode 3 is exposed. Then, e.g., an aluminum film 5A is evaporated on the entire surface. Photoresist 7 is applied thereon. Then a window is formed in correspondence with the protecting film 4. Thereafter, the device is immersed in, e.g., pyrrole organic macromolecular electrolyte, and the aluminum film 5A is set at a specified potential. Then highly conductive polypyrrole polymer is grown at the exposed part of the aluminum film 5A, and a bump electrode 6 of the organic macromolecular polymer is grown. Then, the photoresist 7 is removed. With the bump electrode 6 as a mask, the aluminum film 5A is etched. Then the aluminum film 5A is made to remain only at the lower side of the bump electrode 6, and a metal layer 5 is formed. Thus the titled device is completed.
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