摘要 |
PURPOSE:To form a sheathing resin without unfilled part by opposing a resin inlet to a metal pin forming a hole. CONSTITUTION:Melted resin is filled oppositely perpendicularly to metal pins for forming mounting holes 5a, 5b at gate ports 8 and 8'. According to this method, the resin is contacted with the pin by linearly moving on the surface of an insulating plate. Thus, the resin is dispersed to fill the cavity in the mold. Thus, there occurs no unfilled part of the resin at the corner C of an insulating plate. Further, since the gate port may be set to the position of metal pins, it is not necessary to enlarge the gate port or increase the resin filling pressure, thereby inexpensively and economically manufacturing the same.
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