发明名称 MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form a sheathing resin without unfilled part by opposing a resin inlet to a metal pin forming a hole. CONSTITUTION:Melted resin is filled oppositely perpendicularly to metal pins for forming mounting holes 5a, 5b at gate ports 8 and 8'. According to this method, the resin is contacted with the pin by linearly moving on the surface of an insulating plate. Thus, the resin is dispersed to fill the cavity in the mold. Thus, there occurs no unfilled part of the resin at the corner C of an insulating plate. Further, since the gate port may be set to the position of metal pins, it is not necessary to enlarge the gate port or increase the resin filling pressure, thereby inexpensively and economically manufacturing the same.
申请公布号 JPS62104043(A) 申请公布日期 1987.05.14
申请号 JP19850243634 申请日期 1985.10.30
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 TAKAHASHI KAZUHIKO;KAWACHI AKIYUKI;KOBAYASHI TOMOAKI
分类号 H01L23/28;H01L21/56 主分类号 H01L23/28
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