| 摘要 |
PURPOSE:To perform automatic IC inspection, by providing mechanisms for positioning a magazine, which is taken out of a feeding part, taking ICs out of the magazine, feeding the ICs to a guide path, performing the inspection, putting the ICs in a vacant magazine, and collecting the magazines. CONSTITUTION:A magazine 12 containing ICs 19 is fed to a first positioning mechanism 13 by a handling mechanism 6. Then, a taking-out mechanism 21 sends the IC 19 on a first conveyer 31 from the magazine 12. The IC 19 is sent to a guide path 35 with a pushing plate 34 and conveyed. The appearance and the electric circuit of the IC are inspected in an inspecting part 36, which is provided at the intermediate part of the guide path 35. A mark is applied to the IC in a marking part 37. The IC is mounted on a second conveyer 38 from the guide path 35. When a plurality of the ICs are mounted on the second conveyer 38, a putting mechanism 41 is operated and puts the ICs 19 into a containing groove 18 in the vacant magazine 12, which is fixed to a second positioning mechanism 39.
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