| 摘要 |
PURPOSE:To improve the processing capacity by automating baking process and wafer transferring work to transfer the wafer immediately after baking the wafer, thereby accelerating the cooling time of the wafer. CONSTITUTION:A baking furnace device has a furnace and a conveyor. The furnace has a turntable having predetermined number of cassette placing units, and the conveyor has a cassette transferring mechanism, a substrate transferring mechanism for trnasferring substrate contained in the cassette to another cassette, and a cassette removing and inputting mechanism for removing the cassette int the furnace and filling the cassette into the furnace. The cassette containing the substrate is placed in the inlet of the cassette placing base to automatically bake the substrate for a predetermined time, the processed substrate is contained in the cassette, and exhausted on the outlet of the base. Immediately after removing from the furnace, only the cooling of the wafer may be sufficient due to the transfer of another cassette to largely shorten the cooling time.
|
