发明名称 |
SEMICONDUCTOR ASSEMBLY |
摘要 |
A semiconductor circuit arrangement including at least one semiconductor unit provided with a base plate and semiconductor element electrically insulated against the base plate, current conductors connected to the semiconductor unit and a cooling member supporting the semiconductor unit. The arrangement includes a cooling air channel which is divided into a first zone enclosing the cooling member and a second zone enclosing the semiconductor unit and the current conductors connected thereto. A fan is connected for circulating air in the cooling channel. A baffle plate is disposed in the second zone at a distance from the cooling member and is provided with openings for passage of the current conductors. A circuit board for supporting additional circuit elements is disposed to delimit one dimension of the second zone. |
申请公布号 |
EP0051315(B1) |
申请公布日期 |
1987.05.13 |
申请号 |
EP19810109487 |
申请日期 |
1981.11.03 |
申请人 |
SEMIKRON ELEKTRONIK GMBH |
发明人 |
BREHM, HEINZ;WEIGAND, ADOLF |
分类号 |
H01L29/73;H01L21/331;H01L23/467;H01L25/11;H05K7/20;(IPC1-7):H01L23/46;H01L25/10 |
主分类号 |
H01L29/73 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|