发明名称 CONTINUOUS ELECTROPLATING METHOD FOR METALLIC STRIP
摘要 PURPOSE:To form a plating having a uniform thickness in the transverse direction of a metallic strip on said strip without an over-coat and under-coat in the stage of subjecting the surface of the strip to continuous plating by providing freely movable auxiliary cathodes in proximity to the ends of the strip and moving the auxiliary cathodes in such a manner that the currents flowing in both auxiliary cathodes are made equal. CONSTITUTION:Electricity is conducted between the metallic strip 4 and anodes 9 disposed on both sides of the strip 4 via a cathode conductor roll 2 to plate the surface of the strip 4. The auxiliary cathodes 10, 10' are disposed in proximity to both ends of the strip 4 and the spacing from the strip 4 is made changeable by position adjusting mechanisms 11, 11'. The currents flowing in both auxiliary cathodes 10, 10' during the plating operation are inputted to a differential calculator 17 by which the difference between the currents is calculated. The output from the differential calculator 17 is inputted to an auxiliary cathode position adjuster 18 if there is the difference between both currents. The auxiliary cathodes 10, 10' are so moved by the difference in the current values that the currents of both auxiliary cathodes 10, 10' are made equal. The generation of the over-coat and under-coat in the plating layer of the strip 4 is thus prevented.
申请公布号 JPS62103392(A) 申请公布日期 1987.05.13
申请号 JP19850242777 申请日期 1985.10.31
申请人 NIPPON KOKAN KK <NKK> 发明人 HIRANO MASATOSHI;FUTAKI KAZUMOTO
分类号 C25D7/06;C25D21/12 主分类号 C25D7/06
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