| 摘要 |
Centrifugal processing machine for spray processing wafers of silicon and the like the machine having a processing chamber closed by a door and having a generally horizontal orientation with the rotor also substantially horizontally oriented. The peripheral sidewall of the process chamber has an offset defined by overlapping edge portions defining a circumferentially facing drainage slot, facing in the same direction as the rotor revolves; the process chamber being maintained under slightly positive pressure above atmospheric pressure to the extent of about 10 to 12 inches of water; the transparent door panel having a groove at the inner face of the door panel and traversing of the transparent panel from its center in radial directions oblique to each other, and an adjoining dry nitrogen nozzle directing a spray of nitrogen across the inner face of the transparent door panel and across one end of the groove in the door panel.
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