发明名称 RADIATION-CURABLE RESIN COMPOSITION
摘要 <p>PURPOSE:To make it possible to obtain the titled composition having a well- balanced improvement in a curing rate and properties of a cured product, by incorporating a specified hydroxy group-containing (meth)acrylate oligomer as an essential component. CONSTITUTION:A radiation-curable resin composition containing a hydroxyl group-containing (meth)acrylate oligomer of the formula (wherein R groups may be the same or different and are H or methyl and Z groups may be the same or different and are bivalent 2-20C organic groups and n is an integer of 1-100). This resin composition can be obtained from the oligomer of the formula alone or together with a reactive diluent and various a resins which are well-known and common in a conventional radiation-curable resin composition.</p>
申请公布号 JPS62101610(A) 申请公布日期 1987.05.12
申请号 JP19850240661 申请日期 1985.10.29
申请人 NIPPON SHOKUBAI KAGAKU KOGYO CO LTD 发明人 FUKUCHI SHUZO;YAMAGUCHI SHIGERU
分类号 C08F2/46;C08F2/48;C08F20/26;C08F20/28;C08F290/00;C08F299/02;C08F299/04;C09D5/00;C09D11/00;C09D11/10;C09D167/07;C09J4/00 主分类号 C08F2/46
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