LOADING STRUCTURE TO SUBSTRATE OF IC CHIP

摘要

PURPOSE:To improve the workability of a loading process to a substrate of an IC chip by interposing anisotropic conductive adhesives between the IC chip and the substrate and bonding both the IC chip and the substrate. CONSTITUTION:A conductor pattern L on a circuit substrate B is covered with an insulating coverlet K. The coverlet K is removed only in a section connected to an IC in the conductor pattern. An IC pattern on an IC chip is covered with a passivation 10 (an insulating film) with the exception of a pad F section for connection. An insulating coat 20 is applied onto the circumferential side surface of the IC chip. The peripheral section of a resin as a mother material for an anisotropic conductive adhesive sheet C is protruded by pressing, thus realizing the sealing effect of the periphery of the IC.