| 摘要 |
PURPOSE:To manufacture a compound semiconductor solar cell which is of light-weight, low-cost and excellent in strength, without deteriorating its characteristics and with high yield, by making up a thin silicon substrate which leaves a part of silicon substrate thicker than the part of silicon substrate of elements. CONSTITUTION:After forming a light-receiving-side electrode 3 and an antireflection film, etching is performed to constitute a thin silicon substrate. At this time, the warp of a whole wafter is kept within the radius of curvature of about 500cm, for he peripheral structure of solar cell elements before etching has a 500mum thick part which is thicker the silicon thickness of element substrate being about 100mum. The causes to decrease the yield, such as cracks and breaks, etc. due to straightening of warp at the time of glass cover adhesion are eliminated, and the reliability of the solar cell increases. |
