发明名称 |
MANUFACTURE OF PRINTED CIRCUIT BOARD |
摘要 |
<p>A method of making a printed circuit board is disclosed where the substrate (28) is subjected to a corona discharge prior to laminating the conductor forming metallic sheet (24,26) to the substrate (28). The corona discharge promotes good adhesion between the metallic sheet (24,26) and the substrate (28). In the preferred embodiment, the corona discharge is carried out as one step in a continuous on-line fabrication process.</p> |
申请公布号 |
JPS6298798(A) |
申请公布日期 |
1987.05.08 |
申请号 |
JP19860214223 |
申请日期 |
1986.09.12 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
JIYOSEFU JIERAADO HOFUAASU;SAAYADEBUARA BUIJIYAYAKUMAARU BABU |
分类号 |
B32B15/08;B32B37/00;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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