APPARATUS FOR HEATED TIN PLATING OF PRINTED CIRCUIT BOARD AND METHOD OF SOLDERING TERMINALS OF ELECTRONIC PARTS TO CONDUCTOR PATTERNS AND INSERTION HOLES OF PRINTED CIRCUIT BOARD,申请号JP19860240224-传众专利搜索

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发明名称	APPARATUS FOR HEATED TIN PLATING OF PRINTED CIRCUIT BOARD AND METHOD OF SOLDERING TERMINALS OF ELECTRONIC PARTS TO CONDUCTOR PATTERNS AND INSERTION HOLES OF PRINTED CIRCUIT BOARD
摘要
申请公布号	JPS6298692(A)	申请公布日期	1987.05.08
申请号	JP19860240224	申请日期	1986.10.11
申请人	KASUPAARU AIDENBERUKU	发明人	KASUPAARU AIDENBERUKU
分类号	B23K1/20;B23K1/08;B23K3/06;C23C2/00;C23C2/08;H05K3/24;H05K3/34	主分类号	B23K1/20
代理机构		代理人
主权项
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