| 摘要 |
<p>PURPOSE:To increase cleavage accuracy, obtain a transparent cleavage face, and achieve high intensity output, by making it possible to cleave a crystal with the same position and direction as those of a prescribed flaw. CONSTITUTION:On a Y-stage, the following are mounted; a rotary stand 33 driven by a motor 32, a vacuum chack 35 to adsorb a wafer 34 and a cleavage mechanism part 37 on the top of which a blade 36 is fixed. The Y-stage is transferred in the Y-direction 41 via linear guides 39 and 40 for a base 38. A wafer is stuck to an adhesive tape 43 of a wafer holder 42, which can be fixed on a X-stage by a pin 44. A diamond point 45 descends and ascends along the wafer surface according to a up-and-down mechanism 46. A TV camera 47 is installed above the wafer, which is connected to a control circuit system 49 together with a TV display 48 to monitor the wafer surface.</p> |
