发明名称 RESIN SEAL TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To resist even an external electric field strongly and even the change of external environment sufficiently by forming structure in which a positioning metal is not exposed completely. CONSTITUTION:Hanging pin sections are shaped at notch sections 7 at two corner sections on the side reverse to the lead wire 2 side of a molding resin, and the notch sections 7 containing the hanging pin sections are coated with an applying resin. That is, the hanging pin sections for positioning are shaped at the notch sections 7 in a sealing resin 1, and the resin 8 is applied so as to coat the hanging pin sections. Structure in which the hanging pin sections for positioning are not exposed and only the lead sections and the sealing resin 1 and the resin 8 are observed visually is formed.
申请公布号 JPS6298650(A) 申请公布日期 1987.05.08
申请号 JP19850238756 申请日期 1985.10.24
申请人 NEC CORP 发明人 OKAMURA YOSHIO
分类号 H01L23/28;H01L23/31 主分类号 H01L23/28
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