| 摘要 |
PURPOSE:To enable pressure applied to a semiconductor wafer having a small area or a space between the wafer and a polishing plate to be adjusted to a value suited for polishing by adding a buoyancy plate to an applying plate to easily reduce the weight of applying plate in grain liquid. CONSTITUTION:A buoyancy plate 5 made of material having specific gravity smaller than grinding grain liquid 4 or foamed polystyrene provided in the interior with a cavity and having apparent specific gravity reduced is fixed by a stopper 6 to the upper portion of an applying plate 3 attached to a sample 2 to be polished. The weight of the applying plate in the grinding grain liquid 4 is reduced by the buoyancy action of the buoyancy plate 5 to set a press force to workpiece 2 like semiconductor wafer in polishing or a space between the workpiece 2 and a polishing board 1 to a value suited for polishing. |
