RESIN SEALING METALLIC MOLD FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enable the bubbles to be externally discharged rapidly along sidewalls when melted resin is flowing from a cull part to a runner part by a method wherein air vents making a fine gap between a top force and a bottom force on the edges of cull part and runner part in a center block metallic are provided. CONSTITUTION:Air vents 32 are formed so that the upper edge faces of a cull part 18 and a runner part 20 may make a fine gap between a top force 22 and themselves specified to be 0.02+ or -0.005mm. Therefore, the gap between the top force 22 and a bottom force 24 formed by the air vents 32 is formed into vent grooves 34 for any residual bubbles contained in a table type resin 26. The vent grooves 34 are deeply excavated by the air vents 32 around the air vents 32 to arrest the bubbles released from the cull part 18 or the runner part 20 and a bit of leaked resin. Furthermore, an external air vent 36 communicating with the vent grooves 34 is provided to externally discharge the bubbles or a bit of leaked resin.