发明名称 GLASS-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable the sure fixation of a lead even when there is nonuniformity in the thickness of the end portion of an inner lead or in the thickness of sealing glass, by providing a projection on the lower side of the end portion of the inner lead. CONSTITUTION:A lead 16 is superposed on a base 11 and then it is knocked in the base 11 by a stamper 1. Thereby a projection 17 formed in the end portion 16a of each inner lead is driven into sealing glass 14, and each and every lead is thereby fitted surely and closely to the sealing glass 14 even when there is some nonuniformity in the thickness of the lead 16 or the thickness of the sealing glass 14. In other words, the nonuniformity in the thickness of the lead 16 or the thickness of the sealing glass 14 is absorbed by the height H of the projection 14. In a wire bonding process subsequent to the above, therefore, ultrasonic vibrations can be given while a sufficient bonding load is applied to each and every inner lead, and thus firm wire bonding can be effected.
申请公布号 JPS6298757(A) 申请公布日期 1987.05.08
申请号 JP19850237430 申请日期 1985.10.25
申请人 HITACHI HOKKAI SEMICONDUCTOR LTD;HITACHI LTD 发明人 KASAI NORIHIKO
分类号 H01L23/50;H01L23/10 主分类号 H01L23/50
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