| 摘要 |
<p>A composition and process for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation. The process prevents the copper oxide layer from being leached away by the processing solutions used in preparing the circuit boards. The leaching is prevented by contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide, prior to employing the processing solutions which would leach the copper oxide.</p> |
