| 摘要 |
A homogeneously hardened or depth hardened component part is formed with a split gap. In order to obviate time- and cost-intensive metal cutting operations that serve for influencing the path of the split gap, prior to the splitting operation, one of the surfaces (4) of the component part (1) is subjected, at least along a part of the intended path (5) of the split gap and within confined limits transversely thereto, to the action of an energy-rich radiation such as a laser beam or electron beam. Tensile stress, to cause splitting, is provided by a punch (3). For a peripheral split, a groove may extend for part of the intended splitting path, with radiation applied in the groove. A wedge splitter is used against groove side walls. <IMAGE> |
