| 摘要 |
<p>PURPOSE:To obtain the titled composition having excellent moisture resistance and thermal cycling resistance and low stress, and being free of fin formation and suitable for electrical components etc., by mixing an epoxy resin with a novolak phenolic resin, a specified copolymer resin and an inorganic filler. CONSTITUTION:A mixture obtained by mixing an epoxy resin (A) having at least two epoxy groups in the molecule with a novolak phenolic resin (B) obtained by reacting a phenol with (para)formaldehyde so that the equivalent ratio of the epoxy groups of component A to the phenolic hydroxyl groups of component B may be 0.1-10 is mixed with 0.1-30wt%, based on the composition to be obtained, a polyurethane/methyl methacrylate copolymer resin (C), 25-90wt%, based on the composition, inorganic filler (D) (e.g., silica powder) and, optionally, a mold release, flame retardant, colorant, silane coupling agent, cure accelerator, etc.</p> |
