| 摘要 |
<p>In a semiconductor module with a substrate (10) having a plurality of semiconductor devices (12) mounted on the top surface, an internal metallurgy system interconnecting said devices, an auxiliary set of conductive lines with periodically occurring surface connecting terminals, a pattern (15) of engineering change terminals with electrical connections to the device terminals and to the internal metallurgy system, the improvement to provide engineering change devices (14) mounted on the top surface, having terminal means on the surface of the engineering change devices to establish electrical contact with the pattern (15) of engineering change terminals and the surface connecting terminals, and a tailorable metallurgy system which permits selective electrical contact between individual terminals of the terminal means, and a means on the substrate to selectively electrically isolate selective engineering change terminals from the internal metallurgy. </p> |
