| 摘要 |
PURPOSE:To provide the titled ultrafine Cu wire having the low hardness approximately equal to the hardness of an ultrafine Au wire by incorporating specific ratios of Mg, Ca, Be, In, Ge, Ga, and Tl as alloy components into Cu and specifying the content of inevitable impurities. CONSTITUTION:The ultrafine Cu alloy wire made of the compsn. contg. <0.1-1ppm 1 or >=2 kinds among Mg, Ca, Be, In, Ge, Ga, and Tl as the alloy components and consisting of the balance Cu and <=4ppm inevitable impurities is prepd. Such ultrafine Cu alloy wire is a soft material having about 34-35 Vickers hardness in the stock state and since the deterioration in the characteristics with lapse of time as is observed with a semi-hard material, i.e., ultrafine high-purity copper material wire for semiconductor devices no only in the thoroughly annealed state but also the semi-hard material state. |
