| 发明名称 |
THERMAL CONDUCTION ELEMENT FOR SEMICONDUCTOR DEVICES |
| 摘要 |
<p>A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.</p> |
| 申请公布号 |
EP0071748(B1) |
申请公布日期 |
1987.05.06 |
| 申请号 |
EP19820105772 |
申请日期 |
1982.06.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HORVATH, JOSEPH LOUIS |
| 分类号 |
H01L23/36;H01L23/367;H01L23/433;(IPC1-7):H01L23/42 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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