发明名称 SPUTTERING ELECTRODE
摘要 PURPOSE:To increase the rate of film coating in a difference part in level by providing a slant on a target face generating a plasma ring and by making the adhesion quantity of a filming material on both a side wall part of the difference in level of the difference part in level and a flat part on the surface of a base material uniform. CONSTITUTION:The target faces opposite to a base plate 1 to be coated wherein the targets 2-2, 2-3 have a shape of an axis-symmetrical rotating body form are provided with the slanted faces (e.g. angles theta1 and theta2). The targets are divided into every members contg. the slanted faces and each member is electrically insulated from each target member. Voltage is impressed from the electric power sources 29, 30 to the insulated members respectively and independently. Furthermore the closed magnetic fields 19, 20 which start from each slanted face and reenter the same slanted face are formed on each slanted face.
申请公布号 JPS6296671(A) 申请公布日期 1987.05.06
申请号 JP19850235202 申请日期 1985.10.23
申请人 HITACHI LTD 发明人 SHIMIZU TAMOTSU;OGAWA TSUNEO;NISHIJIMA HIKARI;OYAMADA TAKESHI
分类号 C23C14/34;H01L21/203;H01L21/285;H01L21/31;H01L21/3205 主分类号 C23C14/34
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