发明名称 |
Adhesive composition |
摘要 |
An improved adhesive composition comprised of a thermoplastic adhesive resin particularly a polymeric fat acid polyamide having small amounts of a bisphenol added as an adhesion promoter. The combination provides improved adhesion to various plastic substrates and a lower viscosity which facilitates application of the resin to substrates.
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申请公布号 |
US4663371(A) |
申请公布日期 |
1987.05.05 |
申请号 |
US19850763842 |
申请日期 |
1985.08.08 |
申请人 |
HENKEL CORPORATION |
发明人 |
ARNOLD, HEINZ B.;WORKMAN, CLAYTON E. |
分类号 |
C08K5/13;(IPC1-7):C08K5/13;C08L77/00 |
主分类号 |
C08K5/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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