发明名称 Adhesive composition
摘要 An improved adhesive composition comprised of a thermoplastic adhesive resin particularly a polymeric fat acid polyamide having small amounts of a bisphenol added as an adhesion promoter. The combination provides improved adhesion to various plastic substrates and a lower viscosity which facilitates application of the resin to substrates.
申请公布号 US4663371(A) 申请公布日期 1987.05.05
申请号 US19850763842 申请日期 1985.08.08
申请人 HENKEL CORPORATION 发明人 ARNOLD, HEINZ B.;WORKMAN, CLAYTON E.
分类号 C08K5/13;(IPC1-7):C08K5/13;C08L77/00 主分类号 C08K5/13
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