| 摘要 |
PCT No. PCT/NL85/00032 Sec. 371 Date Mar. 25, 1986 Sec. 102(e) Date Mar. 25, 1986 PCT Filed Jul. 31, 1985 PCT Pub. No. WO86/01034 PCT Pub. Date Feb. 13, 1986.Method of transporting and processing of substrates, including wafers of the type used for semiconductors. Particularly, a method of flowing fluid medium longitudinally within a confined passageway so that the substrate is supported, transported and processed in a double floating condition without touching the walls of the passageway. The method is characterized by the restricting of flowing of fluid medium into the passageway, so as to guide the substrate during transport and processing by injecting pressurized coating medium into the passageway at a series of processing stations defined intermediate transport sections of said passageway.
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