Thermal imaging device and a method of manufacturing a thermal imaging device

摘要

A thermal imaging device comprising a ferroelectric or pyroelectric slab bearing an infrared-permeable common electrode on one main surface and a signal electrode structure on the opposite main surface. The signal electrode structure is electrically connected to electrodes of a circuit substrate by means of solder bumps fused to conductors surrounded by a thermal insulating material. A problem in such thermally imaging devices is the heat conducted transverse to the longitudinal axes of the conductors, so that cross talk occurs between adjacent sensing regions. The transverse heat conduction between adjacent conductors is reduced by using conductors which are each in the form of a metal coating on a bore in a respective pillar of thermally insulating material, the pillars are separated by channels.