发明名称 SEMICONDUCTOR RESIN SEALING METALLIC MOLD DEVICE
摘要 PURPOSE:To improve the workability while preventing the air from mixing with melted resin by a method wherein a pot for a transfer molding metallic mold is shortened down to the surface of base plate while ejecter plates are specified to be separable type. CONSTITUTION:A pot 1 is specified to be 90-110mm long with the top surface thereof almost flush with the surface of a mold base 27 while ejector plates 2, 2 covering the mold base 27 are specified to be separable type. Besides, the surface of mold base 27 is specified to be 50-60mm distant from the surface of ejector plates 2, 2 80mm distant from each other. In such a constitution wherein the separable ejector plates 2, 2 can be sufficiently distant from each other in addition to the short leng th of pot 1 that can be contained easily without being caught by anything on the way, the workability can be improved notably. On the other hand, this compact pot 1 can be adopted so that the air flowing together with melted resin in the channel of pot 1 may be reduced to be prevented from mixed with a semiconductor to be sealed causing blowholes.
申请公布号 JPS6294947(A) 申请公布日期 1987.05.01
申请号 JP19850234473 申请日期 1985.10.22
申请人 TOSHIBA CORP 发明人 TOGASHI MINORU
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29C45/40;B29K101/10;B29L31/34 主分类号 H01L21/56
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