| 摘要 |
PURPOSE:To measure a semiconductor chip without incorporating in a measuring jig and to contrive the shortening of the measuring time and the reduction in the measuring cost and the improvement of the measurement accuracy by a method wherein, in a semiconductor device to be operated in a high-frequency region, grounding pads formed in such a way as to be connected to the earth conductor through the side surfaces of the substrate are provided in the vicinities of the input/output pads of the microstrip line on the substrate. CONSTITUTION:Grounding pads 9 are provided in the vicinities of input/output pads of a microstrip line on a substrate in such a way as to be connected to an earth conductor 8 on the substrate back surface through metallized layers 10 and 11 provided on the side surfaces of the above substrate. Since the grounding pads 9 are provided in the vicinities of the input/output pads in such a way, terminals 2, 3 and 4 of probe heads can be each brought into contact to pads 7 and 9 on a chip. Hereby, the semiconductor chip can be measured without being buried in a measuring jig. |
