发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE:To provide a curable resin composition containing a specific epoxy vinyl ester resin, a polymerizable vinyl monomer and an organic solvent at specific ratios, having excellent heat aging characteristics, corrosion resistance, mechanical properties, adhesivity, etc., and useful as a molding material, etc. CONSTITUTION:The objective composition can be produced by compounding (A) 95-30pts.wt. of an epoxy vinyl ester resin produced by reacting (i) a bisphenol novolac epoxy resin produced by the reaction of epichlorohydrin or beta-methylepichlorohydrin to a condensation product of a bisphenol and an aldehyde with (ii) preferably 0.8-1.0 equivalent [based on epoxy group of the component (i)] of an unsaturated monobasic acid (e.g. acrylic acid) at 80-120 deg.C and (B) 5-70pts.wt. of a polymerizable vinyl monomer (e.g. styrene) and/or an organic solvent (e.g. methanol).
申请公布号 JPS6295313(A) 申请公布日期 1987.05.01
申请号 JP19850234475 申请日期 1985.10.22
申请人 DAINIPPON INK & CHEM INC 发明人 KITAZAWA SEIICHI;YASUDA TADASHI
分类号 C08F299/02;C08F290/00;C09D5/00;C09D11/033;C09D11/10;C09D11/101;C09D11/102;C09D11/106;C09D163/10 主分类号 C08F299/02
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