| 摘要 |
PURPOSE:To obtain a semiconductor memory storage capable of mounting with high density by sticking surfaces not mounted in two base body sections, on which semiconductor chips are mounted and to which wires are connected in a predetermined manner, together by a double-side adhesive tape and sealing the whole with a resin while leading out an external lead. CONSTITUTION:Semiconductor chips 11 and 11' are each fixed to the surfaces and backs of islands 15 and 15' for fastening the semiconductor chips in two base body sections, and each semiconductor chip is connected to external leads 12 and 12' by using wires 13 and 13'. Surfaces not mounted of the islands 15 and 15' are bonded with adhesives 21, and external leads 12 and 12' positioned on the outsides of the islands are unified by polyimide group both-side adhesive tapes 17 and 17'. The whole is sealed with a resin 22 while the external leads 12 and 12' are exposed to the outside. Accordingly, twice as many semiconductor chips as conventional devices can be mounted in the same area, and operation can be continued by the other chip even when one chip gets trouble. |
