| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit with multi-bit output and low cost by a method wherein a plurality of circuits for M-bit chips and connecting means between those circuits are formed on a wafer and a plurality of circuits are cut out with N circuits as a unit to provide the circuit of N XM bits. CONSTITUTION:A plurality of circuits (n) and (n+1) for M-bit chips are formed on an Si wafer and chip connecting means 20 for connecting those circuits are formed. Before the wafer is cut, the respective circuits (n) and (n+1) for chips are tested and if the circuits are successively operated normally, the wafer is cut with N circuits as a unit to provide IC's of N X M bits. The circuits for chips which are determined to be defective are cut off. The wafer is cut by cutting conductive lines 21 simultaneously. Short-circuit lines l1 and l2 are connected inside or outside the IC package. |
