| 摘要 |
<p>PURPOSE:To obtain a semiconductor device which has small internal stress and excellent moisture resistance and heat shock resistance by molding a semiconductor element with epoxy resin compound containing specific components. CONSTITUTION:A semiconductor element is molded with epoxy resin compound, which is composed of epoxy resin, phenolic resin and fine particles composed of cores of silicone compound particles and shells of resin with glass transition temperature of higher than 70 deg.C outside the particles, to constitute a semiconductor device. The epoxy resin, which has a melting point above room temperature and shows solid state or high biscosity liquid state at room temperature or below, is recommended. Single unsaturated monomer which has at least one unsaturated double bond or 2 or more types of such monomers may be used as the resin covering the silicone compound particles. Hardening accelerator, inorganic filler, coupling agent, flame retardant material and pigment may be added to the epoxy resin compound.</p> |
