| 摘要 |
<p>PURPOSE:To form the molded body of an image sensor efficiently by a method wherein the solid state image sensor is bonded to a resin sealed substrate in which a lead frame is solidly sealed with epoxy resin and a transparent window is provided on the surface of the substrate. CONSTITUTION:A lead frame 1, which is punched out by a press from aluminum- steel cladded plate, is solidly molded with epoxy resin 2 to form a resin sealed substrate. A solid state image sensor 3 is bonded to the resin sealed substrate for assembly and lead wires 4 made of aluminum are bonded by ultrasonic wave as the lead wires which connect the lead frame to the solid state image sensor 3. Then a transparent window 6 made of hard-coated plastic or the like is bonded to the surface of the resin 2 with adhesive 5 such as epoxy.</p> |
