发明名称 INTEGRATED CIRCUIT COOLING APPARATUS
摘要 PURPOSE:To obtain an integrated circuit package cooling apparatus with pipings which can be disconnected without fear of liquid leakage when maintenance, inspection and repair of the integrated circuit packages are carried out by arranging a piping system to supply coolant to a cooling jacket and a piping system to supply gas in parallel through changeover means. CONSTITUTION:During normal operation, valves 13 and 14 are closed and valves 11 and 12 are opened and coolant is supplied to respective integrated circuits or integrated circuit packages 2 to cool them. When connectors 5 of coolant pipings 10 are disconnected, the valves 11 and 12 are closed to discontinue the flow of the coolant. Then the valves 13 and 14 are opened to discharge the coolant through a drain 10D by purging gas. Therefore, the connectors 5 can be disconnected without fear of liquid leakage.
申请公布号 JPS6293966(A) 申请公布日期 1987.04.30
申请号 JP19850233251 申请日期 1985.10.21
申请人 HITACHI LTD 发明人 HIGETA KAZUYA;OGURO MUNEHIRO;ASHIWAKE NORIYUKI;TAKENAKA TAKATSUGU
分类号 H01L23/473 主分类号 H01L23/473
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