发明名称 Composite of metal and resin having electrolytically reduced metal layer and process for producing the same
摘要 A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.
申请公布号 US4661417(A) 申请公布日期 1987.04.28
申请号 US19840687754 申请日期 1984.12.31
申请人 HITACHI, LTD. 发明人 SUZUKI, YOSHIHIRO;SATOH, NOBUHIRO;WAJIMA, MOTOYO;NARAHARA, TOSHIKAZU;SHIMAZAKI, TAKESHI
分类号 H05K3/38;H05K3/46;(IPC1-7):B32B15/08 主分类号 H05K3/38
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