| 摘要 |
This invention is for a process for applying a smooth uniform layer of a photoresist to a base material. In the process, a laminate is provided comprising a layer of light-sensitive photoresist, a permeable backing layer and an intermediate layer displaced between the light-sensitive photoresist layer and the backing layer, the intermediate layer being soluble or degradable in water or developer for the light-exposed photoresist of the laminate. In use, this laminate with the light-sensitive photoresist layer face downward is adhered to a base material and washed with a solvent for the intermediate layer. The solvent permeates and undercuts the backing layer thereby solvating the intermediate layer, and breaking the bond between the backing layer and the light-sensitive layer. The backing layer may then be peeled from the photoresist layer. If the backing layer transmits light, the composite comprising the base material and the laminate may be exposed prior to the washing step and the washing step may be performed with a developer for the light-exposed light-sensitive photoresist layer. A preferred backing layer is clay filled paper having a smooth, glazed surface. An adhering agent may be applied over the photoresist layer if desired.
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