MANUFACTURE OF PLANE ANTENNA

摘要

PURPOSE:To uniformize the thickness by providing the temperature at which a dielectric base is bonded near the melting point of the dielectric base so as to decrease the flowing amount of the dielectric base. CONSTITUTION:A grounding conductor base 4, an adhesive film 6 and a dielectric base material 7b are bonded by high temperature press to form a lower base 9. The temperature is this case is selected to a bonding temperature (nearly 160 deg.C) of the film 6. The adhesion film 6 and the dielectric base material 7a are bonded by a high temperature press on the printed board comprising a protection film 2 and a microstrip line 5 to form the upper base 8. The temperature in this case is the same as above. The lower base 9, the dielectric base 3 and the upper base 8 are bonded by hot press. In this case, the material is molten thermally by the melting point (nearly 120 deg.C) of the material 3. As a result, the quantity of the antenna base 1 flowing of the outside of the base is less.