| 摘要 |
Wafers are unloaded from a hot wafer processing boat of the type having a plurality of elongated parallel electrodes defining elongated processing gaps therebetween with the wafers being serially spaced apart lengthwise of the gap. A wafer carrier, into which the wafers are to be unloaded from the hot boat, has elongated receiving means, preferably formed by folds of the wafer carrier, extending lengthwise of the elongated electrodes of the boat. The wafer carrier is positioned over the boat and the boat and the carrier are inverted so that the wafers drop from the hot boat into the receiving means of the wafer carrier. In a preferred embodiment, once the wafers have been unloaded onto the folded wafer carrier, the wafer carrier is unfolded to facilitate access to the wafers.
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