| 摘要 |
PURPOSE:To fill a clearance between a through-hole section and a lead pin all over with solder, and to fix the through-hole section and the lead pin positively by boring a communicating path, through which a solder liquid is made to pass through the through-hole section, to a collar section in the lead pin. CONSTITUTION:A lead pin B inserted and connected to a through-hole section 1 in a chip-on-board A has a leg lever section 2 being soldered, while the intermediate section of the section 2 and a collar section 3 brought into contact with a lower opening section in the through-hole section 1, and a communicating section 4 through which a solder liquid is made to pass through the through-hole section 1 is bored to the collar section 3. According to said constitution, the solder liquid (m) rises in a clearance between the through-hole section 1 and the lead pin B through the communicating path 4 for the collar section 3 by a capillary phenomenon generated in the clearance and filled into the clearance by dipping the lower surface side of the board A into the solder liquid, and the upper periphery and collar-section periphery of the lead pin B are covered, thus fixing the lead pin to the through-hole section. |
