| 摘要 |
PURPOSE:To increase the adhesion of resin mold, and to improve bonding properties by attaching Cu or a Cu alloy having conductivity of 80% IACS or more to a base material consisting of the Cu alloy having conductivity of 12% IACS or less and bringing the whole conductivity to 5-30% IACS. CONSTITUTION:A Cu alloy having conductivity of 12% IACS or less is used as a base material for lead materials 2, 3. Cu or a Cu alloy having conductivity of 80% IACS or more is attached to the whole surface or partial surface of the base material, and the whole conductivity is adjusted to 5-30% IACS. The Cu alloy containing Ni is employed as the base material. Accordingly, the adhesion of resin mold is increased, and bonding properties are improved. |
