| 摘要 |
<p>PURPOSE:To reduce the cost by sealing a semiconductor element from both end sides of an annular hollow insulator through an elastic resin by the first and second electrodes to facilitate the steps. CONSTITUTION:After an O-ring 15 is engaged with a hollow insulator 14, the first electrode plate 12 is clamped to the lower portion of the insulator 14. Then, a semiconductor element 11 is placed on the plate 12. Thereafter, the second electrode plate 13 is clamped to the top of the insulator 14. Since the inner hermetical seal cannot be held only by the ring 15, an elastic resin 17 is sealed in an air gap between the engaged threads 16a and 16b to form a structure which can endure a heat cycle, an impact and waterproof. After the resin 17 is sealed, aftercure is executed. Accordingly, an expensive ceramic may not be used, and the steps can be ready.</p> |
