| 摘要 |
<p>PURPOSE:To eliminate a defect or a crack on a chip by securing one side of a multichip wafer to a wafer supporting base, then blowing sand and air to a multichip while rotating the nozzle of a sandblasting machine to punch a semiconductor chip. CONSTITUTION:A silicon wafer 1 of a multichip wafer is placed through a molybdenum plate 1 brazed to the wafer 1 on a wafer supporting base 15, and attracted from a suction hole 17 to be fixed. Then, an X-Y table 16 is moved, and the center of a rotary plate 13 is matched to that of the plate 2. Thereafter, when a sandblasting machine 8 is started, a motor 6 is simultaneously started to rotate the plate 13. Then, a nozzle 14 is rotated, but sand and air fed from the machine 8 are fed through a tube 9 to between the upper and lower sealing bearings 10 and 10 around the plate 13. Thus, the sand and air are always diffused from a nozzle 14 to be blown to the wafer 1, which is cut in a circular shape from the surface, and then punched.</p> |
