| 摘要 |
PURPOSE:To reduce the cost by using a conventional semiconductor device in a printed substrate on which a plurality of IC chips are placed on a die stage of a lead frame by wiring the inner leads of a lead frame, the pads of the IC chips and pads provided on the substrate. CONSTITUTION:A printed substrate 1 for placing a plurality of semiconductor chips 2 is placed on a die stage 4 of a lead frame, the terminal of the inner leads 6 of the lead frame, the pad 7 of a semiconductor chip, and a pad 5 formed on the printed board are wired. A plurality of IC chips 2 are placed through the substrate 1 to prepare in advance wirings between the pad 7 of the IC chips and the pads 5 of the substrate, placed on the stage 4, and then the wirings with the terminal of the inner leads are executed by an automatic machine as it is. Multilayer printed substrates are used as the substrate to wire in case of cross wirings, and a problem of a shortcircuit in the through hole can be avoided by providing an insulating layer on the back surface of the substrate. |
