| 摘要 |
<p>PURPOSE:To obtain a semiconductor device having a function for simply and substantially completely discovering a breakage malfunction of an IC chip by providing a conductive strip by utilizing the effective area outer periphery of a chip at an integrated circuit chip unit on a substrate, and further connecting both ends with a test pad. CONSTITUTION:When an integrated circuit 2 and its bonding pad A are formed at every chip unit on a substrate 1 of chip unit, a conductive strip 5 of aluminum of desired width insulated from the substrate 1 is simultaneously formed around a pad region 4 on the effective area outer periphery 3 of the substrate 1 at every chip unit, and the both ends of the strip 5 are connected with a test pad B formed by arranging together with the pad A. Therefore, after many integrated circuits 2, the pads A formed at the periphery, the test pad B and the strips 5 formed at the periphery are formed at chip unit on a wafer substrate, the wafer substrate is scribed by a dicing unit to obtain silicon integrated circuit chips.</p> |
