| 摘要 |
PURPOSE:To constitute the titled method so that cutting-off of a bonding wire is prevented to stabilize manufacture of a casing of an integrated circuit element, by a method wherein a casing of one side of a lead frame is molded by a primary mold on only one side of a movable mold or stationary mold of which a cavity has been formed and the other side casing is molded by a secondary mold on both of a movable and stationary molds of which a cavity has been formed. CONSTITUTION:A lead frame L is fitted to a recessed part 1 of a primary mold 3a by turning the surface of the lead frame L whereon an IC element I is mounted into a stationary mold 2 side. Theremoplastic resin is injected through a nozzle 13 after closure of a movable mold 1 and simultaneously with mold break an ejector pin 18 is ejected into a cavity 2a after cure through cooling. A semiproduct S' is peeled off from the stationary mold 2, and is carried up to an ejection position and removed from the movable mold 1 by an ejector up to an ejection position and removed from the movable mold 1 by an ejector pin 9. Neither the cut-off of bonding wire B nor the spoilage of the IC element I occurs as the surface is covered already. A product is obtained by inserting the semiproduct S' into a cavity 1b of the movable mold 1, fitting the same to a secondary mold 3b and performing injection and the mold break of the same again. |
